Description
X-ray inspection system UNICOMP AX8200MAX is designed for obtaining X-ray images with high resolution, primarily for the electronics industry. This universal system is used for quality control of SMD assembly in BGA, CSP, Flip Chip, LED, Fuse, DIODE and other packages. Also these systems are used to check semiconductor assemblies, batteries and check microchips for their functionality and counterfeit origin.
The Unicomp AX-8200MAX has a large inspection area and a tilt angle of up to 60°. Accurate BGA void measurement software allows the user to determine if solder voids are within tolerance, and step-by-step programming ensures that problem areas on the PCB can be inspected in seconds – all while capturing high-resolution images. With few moving parts, this machine requires minimal maintenance, making it ideal for CEMs and OEMs.
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